Cookie preferences
This website uses cookies, which are necessary for the technical operation of the website and are always set. Other cookies, which increase the comfort when using this website, are used for direct advertising or to facilitate interaction with other websites and social networks, are only set with your consent.
Configuration
Technically required
These cookies are necessary for the basic functions of the shop.
"Allow all cookies" cookie
"Decline all cookies" cookie
Advanced Cart
CSRF token
Cookie preferences
Currency change
Customer recognition
Customer-specific caching
Individual prices
Selected shop
Session
Comfort functions
These cookies are used to make the shopping experience even more appealing, for example for the recognition of the visitor.
Note
Store Locator
Statistics & Tracking
Affiliate program
Channeltracking
Conversion and usertracking via Google Tag Manager
Track device being used
Article successfully added.

Almit Solder paste lead-free, LFM 48W SUC UI, 20-38 µm, Can 500 g

Almit
801305
From €113.38 *
Content: 0.5 Kilogramm (€226.76 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

  • Availability: Currently not in stock.
    Delivery time expected 43 days.

    Content

    Dose 500 g

    Grain size

    • Catalogue no.: 801305
    • Article no.: ALM81150099
    • EAN: 4050075563371
    • Manufacturer: Almit
    • Man.-art.-no.: 81150099
    • Sales unit: Stück
    • Packaging unit: 1
    Description Features
    Description
    The paste makes it possible to switch from soldering under nitrogen to nitrogen-free soldering. more
    Close menu
    The paste makes it possible to switch from soldering under nitrogen to nitrogen-free soldering.

    Melting range: 217-220 °C
    Flux: SUC-UI
    Flux content: 11,5 %
    Weiterführende Links:
    Features
    O²-Reflow, wenig Lunker und hohe Vorheiztemperatur gleichbleibende Pastenmenge und... more
    Zurück
    • O²-Reflow, wenig Lunker und hohe Vorheiztemperatur
    • gleichbleibende Pastenmenge und Druckqualität
    • gute Benetzung auch unter normaler O²-Atmosphäre
    • formstabil auf allen Teilen
    • Stickstoff wird nicht benötigt, wodurch laufende Kosten gesenkt werden können
    • Reduzierung des Energieverbrauchs trägt zur Verringerung der CO²-Produktion bei
    • gute Benetzung auf Nickeloberflächen
    • kann BGA Benetzungsprobleme und ''Head-In-Pillow'' Defekte beseitigen
    • hohe Zuverlässigkeit durch "No Clean"- Flussmittel
    Customers also bought Customers also viewed
    Customers also bought
    Customers also viewed
    Viewed
    This website uses cookies, which are necessary for the technical operation of the website and are always set. Other cookies, which increase the usability of this website, serve for direct advertising or simplify interaction with other websites and social networks, will only be used with your consent. More information
    Decline Accept all Configure