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Article successfully added.

Almit Solder paste lead-free, LFM 48W SUC UI, 10-28 µm, Can 500 g, 10-28 µm, Can 500 g

Almit
801306
€133.32 *
Content: 0.5 Kilogramm (€266.64 * / 1 Kilogramm)

Prices incl. VAT plus shipping costs

  • Availability: Currently not in stock.
    Delivery time expected 21 days.

    Content

    Dose 500 g

    Grain size

    10-28 µm
    • Catalogue no.: 801306
    • Article no.: ALM81140099
    • EAN: 4050075432721
    • Manufacturer: Almit
    • Man.-art.-no.: 81140099
    • Sales unit: Stück
    • Packaging unit: 1
    Description Features
    Description
    Die Paste ermöglicht es, vom Löten unter Stickstoff auf stickstofffreies Löten umzustellen. more
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    Die Paste ermöglicht es, vom Löten unter Stickstoff auf stickstofffreies Löten umzustellen.

    Content: Dose 500 g
    Melting range: 217-220 °C
    Grain size: 10-28 µm
    Flux: SUC-UI
    Flux content: 11,5 %
    Weiterführende Links:
    Available downloads:
    Features
    O²-Reflow, wenig Lunker und hohe Vorheiztemperatur gleichbleibende Pastenmenge und... more
    Zurück
    • O²-Reflow, wenig Lunker und hohe Vorheiztemperatur
    • gleichbleibende Pastenmenge und Druckqualität
    • gute Benetzung auch unter normaler O²-Atmosphäre
    • formstabil auf allen Teilen
    • Stickstoff wird nicht benötigt, wodurch laufende Kosten gesenkt werden können
    • Reduzierung des Energieverbrauchs trägt zur Verringerung der CO²-Produktion bei
    • gute Benetzung auf Nickeloberflächen
    • kann BGA Benetzungsprobleme und ''Head-In-Pillow'' Defekte beseitigen
    • hohe Zuverlässigkeit durch "No Clean"- Flussmittel
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