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WETEC Convection reflow soldering system, max. 200 x 160 mm, max. 160 x 100 mm

815250
From €4,486.30 *

Prices incl. VAT plus shipping costs

  • Currently not in stock. Delivery time: 14 days.
  • Measurements

    Size of circuit boards

    Soldering surface

    • 815250
    • KG-1738.3
    • 4050075787234
    • WETEC
    • RO 160
    • Stück
    • 1
    The device was developed for the requirements of small-scale series production or prototype... more

    The device was developed for the requirements of small-scale series production or prototype construction. While one PCB is being soldered, the next PCB can already be printed or assembled. The automatic soldering process means that you do not have to stand next to it all the time. At the beginning only the printed circuit board is put on and
    Start is pressed. The rest is automatic: bring in - solder - take out - cool down.

    We recommend ordering the reflow soldering system with the "inert gas operation" and "extension measuring channel" options.



    Power: 2 (3,5 bei RO 250BF) kW
    Pre-heating temperature: 50-180 °C
    Pre-heating time: max. 3.600 s
    Soldering temperature: 90-300 °C
    Soldering time: max. 180 s
    Weiterführende Links:
    gleichmäßige Temperaturen durch innovative Konvektionstechnologie Überhitzung einzelner... more
    • gleichmäßige Temperaturen durch innovative Konvektionstechnologie
    • Überhitzung einzelner Bereiche wird durch niedrige Prozesstemperaturen verhindert
    • einfache Programmierung und übersichtliche Prozesskontrolle
    • automatisierter Lötprozess
    • für bleifreies Löten (auch in N2-Atmosphäre, optional erhältlich)
    • optional kann die Temperatur auf 350 °C angehoben werden
    1 Stück Reflow-Lötsystem 1 Stück Software more
    • 1 Stück Reflow-Lötsystem
    • 1 Stück Software
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